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Patent Searching and Data


Title:
PROCESS FOR PRODUCING SOLID-PLATED MATERIAL AND THE SOLID-PLATED MATERIAL
Document Type and Number:
WIPO Patent Application WO/2005/047567
Kind Code:
A1
Abstract:
A process for producing a solid-plated material having a coating layer excellent in conductivity and durability. A coating fluid containing an organic binder is mixed with conductive particles for plating and metal particles for binding to prepare a suspension. The suspension is sprayed on core particles which are being centrifugally fluidized to thereby form on the surface of the core particles a coating layer comprising the plating particles and the binding metal particles tenaciously bonded with the organic binder. Thereafter, the core particles are heated to a temperature not lower than the melting point of the binding metal particles to thereby remove the organic binder by pyrolysis and simultaneously melt the binding metal particles. Thus, a fusion-bonded layer containing the plating particles tenaciously bonded can be formed on the surface of the core particles. When particles of a material having excellent conductivity are used as the particles for plating, a solid-plated material having a coating layer excellent in conductivity and durability can be produced.

Inventors:
Hisada, Wataru (71-2, Azatsukeda Ooaza Nishijou, Ooharu-ch, Ama-gun Aichi 44, 49011, JP)
Tamaki, Kenji (71-2, Azatsukeda Ooaza Nishijou, Ooharu-ch, Ama-gun Aichi 44, 49011, JP)
Application Number:
PCT/JP2004/015684
Publication Date:
May 26, 2005
Filing Date:
October 22, 2004
Export Citation:
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Assignee:
SINTOBRATOR, LTD. (28-12, Meieki 3-chome Nakamura-k, Nagoya-shi Aichi 02, 45000, JP)
Hisada, Wataru (71-2, Azatsukeda Ooaza Nishijou, Ooharu-ch, Ama-gun Aichi 44, 49011, JP)
Tamaki, Kenji (71-2, Azatsukeda Ooaza Nishijou, Ooharu-ch, Ama-gun Aichi 44, 49011, JP)
International Classes:
B22F1/02; C23C4/18; C23C24/04; C23C26/02; H01B1/22; (IPC1-7): C23C24/04; B22F9/00; H01B1/00
Foreign References:
JPS4712405A
JPS59118267A1984-07-07
JPS5177536A1976-07-05
JPS506162B11975-03-11
JPH08257914A1996-10-08
Attorney, Agent or Firm:
Yamasaki, Yukuzo (Yamasaki Law and Patent Office, Sogo Nagatacho Bldg. 8F 11-28, Nagatacho 1-chom, Chiyoda-ku Tokyo 14, 10000, JP)
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