Title:
PROCESS FOR PRODUCING SOLID-PLATED MATERIAL AND THE SOLID-PLATED MATERIAL
Document Type and Number:
WIPO Patent Application WO/2005/047567
Kind Code:
A1
Abstract:
A process for producing a solid-plated material having a coating layer excellent in conductivity and durability. A coating fluid containing an organic binder is mixed with conductive particles for plating and metal particles for binding to prepare a suspension. The suspension is sprayed on core particles which are being centrifugally fluidized to thereby form on the surface of the core particles a coating layer comprising the plating particles and the binding metal particles tenaciously bonded with the organic binder. Thereafter, the core particles are heated to a temperature not lower than the melting point of the binding metal particles to thereby remove the organic binder by pyrolysis and simultaneously melt the binding metal particles. Thus, a fusion-bonded layer containing the plating particles tenaciously bonded can be formed on the surface of the core particles. When particles of a material having excellent conductivity are used as the particles for plating, a solid-plated material having a coating layer excellent in conductivity and durability can be produced.
Inventors:
HISADA WATARU (JP)
TAMAKI KENJI (JP)
TAMAKI KENJI (JP)
Application Number:
PCT/JP2004/015684
Publication Date:
May 26, 2005
Filing Date:
October 22, 2004
Export Citation:
Assignee:
SINTOBRATOR LTD (JP)
HISADA WATARU (JP)
TAMAKI KENJI (JP)
HISADA WATARU (JP)
TAMAKI KENJI (JP)
International Classes:
B22F1/16; B22F1/17; C23C4/18; C23C24/04; C23C26/02; H01B1/22; (IPC1-7): C23C24/04; B22F9/00; H01B1/00
Foreign References:
| JPS4712405A | ||||
| JPS59118267A | 1984-07-07 | |||
| JPS5177536A | 1976-07-05 | |||
| JPS506162B1 | 1975-03-11 | |||
| JPH08257914A | 1996-10-08 |
Attorney, Agent or Firm:
Yamasaki, Yukuzo (Sogo Nagatacho Bldg. 8F 11-28, Nagatacho 1-chom, Chiyoda-ku Tokyo 14, JP)
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