Title:
PROCESS FOR PRODUCTION OF DICING/DIE BONDIND FILM
Document Type and Number:
WIPO Patent Application WO/2010/024121
Kind Code:
A1
Abstract:
A process for production of a dicing/die bonding film, whereby a dicing/die bonding film which exhibits excellent adhesiveness in the dicing step and excellent separability in the pickup step can be produced even on an industrial scale without any design change. The process for production of a dicing/die bonding film comprising a substrate, and a pressure-sensitive adhesive layer and an adhesive layer which are laminated on the substrate successively comprises the step of forming, on a release film, an adhesive layer which contains an inorganic filler and has an uneven surface having an arithmetic mean roughness (Ra) of 0.015 to 1 μm, and the step of laminating the resulting film-adhesive composite with a substrate bearing a pressure-sensitive adhesive layer formed thereon. The lamination step is conducted under the conditions of temperature of 30 to 50 °C and pressure of 0.1 to 0.6 MPa with the adhesive layer being in contact with the pressure-sensitive adhesive layer in such a manner that the area of contact between the pressure-sensitive adhesive layer and the adhesive layer falls within the range of 35 to 90% of the area of lamination.
Inventors:
AMANO YASUHIRO (JP)
MATSUMURA TAKESHI (JP)
INOUE KOUICHI (JP)
MATSUMURA TAKESHI (JP)
INOUE KOUICHI (JP)
Application Number:
PCT/JP2009/064238
Publication Date:
March 04, 2010
Filing Date:
August 12, 2009
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
AMANO YASUHIRO (JP)
MATSUMURA TAKESHI (JP)
INOUE KOUICHI (JP)
AMANO YASUHIRO (JP)
MATSUMURA TAKESHI (JP)
INOUE KOUICHI (JP)
International Classes:
H01L21/52; C09J7/22; C09J7/38; C09J11/04; H01L21/301
Foreign References:
| JP2008135448A | 2008-06-12 | |||
| JP2002256239A | 2002-09-11 | |||
| JP2008124295A | 2008-05-29 | |||
| JP2006339236A | 2006-12-14 | |||
| JP2002256238A | 2002-09-11 | |||
| JP2008218571A | 2008-09-18 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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