PROCESS FOR PRODUCTION OF CURED MOLDED ARTICLE, AND CURED MOLDED ARTICLE

WIPO Patent Application WO/2011/034138

A1

Disclosed are: a cured molded article production process which enables the easy production of a cured molded article that has excellent heat resistance, excellent abrasion resistance, excellent mold release properties and a small shrinkage rate and does not undergo discoloration and is therefore transparent; and a cured molded article which is useful for various use applications such as optical members. Specifically disclosed is a process for producing a cured molded article from a curable resin composition comprising a fusable inorganic compound, a curable organic compound and a curing agent, which is characterized by comprising: a first step comprising a step of thermally curing the curable resin composition at a temperature of 80 to 200˚C and/or a step of curing the curable resin composition by the irradiation with an activity energy ray; and a second step of thermally curing a cured product produced in the first step at a temperature higher than 200°C and equal to or lower than 500°C.

NAKAMURA Jun-ichi (5-8, Nishiotabicho, Suita-sh, Osaka 12, 〒5648512, JP)
中村潤一 (〒12 大阪府吹田市西御旅町５番８号　株式会社日本触媒内 Osaka, 〒5648512, JP)

JP2010/066066

March 24, 2011

September 16, 2010

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NIPPON SHOKUBAI CO., LTD. (1-1 Koraibashi 4-chome, Chuo-ku Osaka-sh, Osaka 43, 〒5410043, JP)
株式会社日本触媒 (〒43 大阪府大阪市中央区高麗橋４丁目１番１号 Osaka, 〒5410043, JP)
NAKAMURA Jun-ichi (5-8, Nishiotabicho, Suita-sh, Osaka 12, 〒5648512, JP)

C08J5/00; B29C71/02; C08G59/02; C08G65/18; C08G77/04; C08J7/00; G02C7/02

YASUTOMI & Associates (5-36, Miyahara 3-chome Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)

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