Process for the production of measured wood chips from wood scraps by use of a template

The present patent of invention refers to a process to make good use of scraps of certified and processed noble wood, usually burnt to generate energy, through a sequence of specific industrial operations with use of a special template to form single items termed chips, which when joined by gluing form items such as billets, blocks, floor manufacturing bases, panels, parquets, S4S, etc., bringing advantages of wood saving, forests preservation, avoidance of deforestations, increasing industrialization rates and low production costs.

As it is known by the technical means linked to the wood-processing engineering, nowadays the scraps of certified and processed noble wood, residues of top cutting process in manufacturing of blocks, parquet, short floors, structural floors, etc., are burnt for steam generation in water boilers due to its irregularity and small dimension and to the difficulty for the economic utilization in the production of wooden pieces.

Searching in the Brazilian patents database, we have found some patent applications which disclose about the utilization of scraps of noble woods: a) Patent application PI8406829-9, which discloses a process for manufacturing boards from scraps of wooden boards, which patched in the longitudinal way form long boards that are glued to each other forming a packed block; b) Patent application PI9605520-0 which discloses a process for recycling scraps or wooden sewed for the production of panels or artifacts of solid wood, through disassembly of the scraps with circular saws, band saws or pitsaws, preparation of slats, amendment for top gluing or finger joint gluing in high frequency gluing presses, transforming them in panels of solid wood of high added value; and c) Patent application PI0313897-6 which discloses product and method to produce structural I-beam of pressed wooden scraps, through interconnection by part of a central core in parts of

flange positioned in parallel to the longitudinal axis of the I-beam, gluing with compressed agglutinated stickers and placement in heated mold, forming a solid I-beam.

Searching in the international patent databases, we have found some patents with proposals for utilization of scraps of noble woods:

A) German patent DE4041704, which discloses a method for production of wooden blocks, particularly for pallets, involving the cutting of the wood in adequate lengths with parallel faces and subsequently division in wood of squared construction, discarding the scraps. The division device consists of four blades that are positioned in the square or rectangle form and mounted in a frame forming a rectangular orifice through which the wood is forced. Boards are screwed in the frame to hold the blades;

B) US Patent US5927359, which discloses a system and method for recycling of sawn wood scraps, obtaining pieces of any length with section of 2 x 4 inches and 2 x 6 inches in finger jointed form, through process for squaring of the tips for cutting, discarding the defective pieces and separating the pieces of 2 x 4 inches and 2 x 6 inches, which are fed in machines for finger jointed process; and

C) German patent DE202005010123U, which discloses bar for construction of composed structures made of wood scraps symmetrically arranged, alternating solid wooden layers with scraps of insulator material.

The disclosed processes have limitations and inconvenient of obtain specific or limited products or with complex processes.

PROCESS TO MAKE GOOD USE OF

WOOD SCRAPS AND RESULTANT TEMPLATE AND CHIP, object of the present patent was developed to overcome the disadvantages, the inconvenient and the limitations of the current processes, as it uses a sequence of specific industrial operations and the use of special template to form single items termed chips which when joined by gluing form items such as billets, blocks and panels, floor manufacturing bases, parquets, S4S,

etc., bringing advantages of wood saving, forests preservation, avoidance of deforestations, with low production costs.

For a better understanding of the present patent, the following drawings are attached:

FIGURE 1, which shows the block diagram of the process of the present patent;

FIGURE 2, which shows a perspective view of the frame of the preset patent;

FIGURE 3, which shows a perspective view of the template of the present patent, for the case of squared pieces; and

FIGURE 4, which shows a perspective view of the chip of the present patent.

The process of the present patent is accomplished in the following sequence:

I) The dry wood scraps (maximum humidity of 18 %) are manually selected with a minimum dimension of 70 mm of length and at least 15 mm of initial thickness;

II) Each piece selected from the scraps is partially cut in two directions with a multiple saw, forming frame (1) with at least three sides, through non-crossing grooves (1-A) with a thickness a bit smaller than the initial thickness, defining the dimension of the chip (2);

III) The frame (1) is encased in the template

(3) with non-grooved face (1-B) turned to the side of the dressing or cut (from top);

IV) It is complementarily processed in a plane, and/or a milling cutter, and/or a saw, and/or a grinder, in order to take out the sleeve of the non-grooved face (1-B), loosening the chips from the template (3), which fall into a collector; and

V) The chips (2) are united by gluing or another conventional means, forming pieces such as such as cylinders, blocks and panels, base for floors production, panels, blocks, parquet blocks, S4S, etc.

The template (3) for the adequate positioning of the frame (1) is constituted of a polygonal prismatic format

with compartments (3 -A) of the same format as the desired chips (2), with hollow bottom.

The chip (2) obtained by the process of the present patent has a polygonal prismatic format with minimum dimensions of 20 mm long, 20 mm wide and 5 mm high, preferred dimensions of 45 mm long, 45 mm wide and 10 mm high.

The particular embodiments does not limit the range of the application of the process of the present patent, in other words, other embodiments can be adopted to carry out the process.