Title:
PROCESS FOR PRODUCTION OF ORGANOPOLYSILOXANE, ORGANOPOLYSILOXANE OBTAINED BY THE PROCESS, AND COMPOSITION THAT CONTAINS THE ORGANOPOLYSILOXANE
Document Type and Number:
WIPO Patent Application WO/2011/108516
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition which contains a heat-stable, siloxane-structure-containing epoxy resin (organopolysiloxane). Curable resin compositions that contain the epoxy resin composition are useful in various uses such as electrical and electronic materials, molding materials, casting materials, laminating materials, coating materials, adhesives, and resists, in particular, extremely useful as materials that require optical characteristics, for example, bonding or sealing materials for optical semiconductors (such as LED devices).
An organopolysiloxane which is prepared through: a step of reacting a silicone oil that has a weight-average molecular weight of 1000 to 3000 and has silanol structures at the ends with an alkoxysilane compound in the presence of an alcohol to form a modified silicone oil; and a step of polymerizing the modified silicone oil alone and/or together with an alkoxysilane compound via hydrolysis.
Inventors:
MIYAGAWA NAOFUSA
NAKANISHI MASATAKA
NAKANISHI MASATAKA
Application Number:
PCT/JP2011/054574
Publication Date:
September 09, 2011
Filing Date:
March 01, 2011
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
MIYAGAWA NAOFUSA
NAKANISHI MASATAKA
MIYAGAWA NAOFUSA
NAKANISHI MASATAKA
International Classes:
C08G77/06; C08G59/20; C08G59/42; C08G77/14; C08K5/11; C08K5/1539; C08L83/06
Domestic Patent References:
| WO2008090971A1 | 2008-07-31 | |||
| WO2009072632A1 | 2009-06-11 | |||
| WO2010026714A1 | 2010-03-11 |
Foreign References:
| JP2000500811A | 2000-01-25 | |||
| JPH09501964A | 1997-02-25 | |||
| JPH0797433A | 1995-04-11 | |||
| JP2006508216A | 2006-03-09 | |||
| JPH07126391A | 1995-05-16 |
Attorney, Agent or Firm:
NAITO TERUO (JP)
Teruo Naito (JP)
Teruo Naito (JP)
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Claims: