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Title:
PROCESS FOR PRODUCTION OF POLYIMIDE FILM HAVING HIGH ADHESIVENESS
Document Type and Number:
WIPO Patent Application WO/2006/033324
Kind Code:
A1
Abstract:
A process for the production of nonthermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of nonthermoplastic polyimide film made of a nonthermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent, (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resulting dope to chemical and/or thermal imidation, wherein the diamine and acid anhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give a thermoplastic polyimide, and the polyimide precursor obtained in the step (B) is a precursor of a nonthermoplastic polyimide.

Inventors:
Kaneshiro, Hisayasu (23-100, Shinmeimiyahigashi Uji-shi, Kyoto 25, 61100, JP)
Kikuchi, Takashi (15-1-203, Hieitsuji-2 Otsu-shi, Shiga 04, 52001, JP)
Application Number:
PCT/JP2005/017283
Publication Date:
March 30, 2006
Filing Date:
September 20, 2005
Export Citation:
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Assignee:
KANEKA CORPORATION (2-4 Nakanoshima 3-chome, Kita-ku Osaka-shi, Osaka 88, 53082, JP)
Kaneshiro, Hisayasu (23-100, Shinmeimiyahigashi Uji-shi, Kyoto 25, 61100, JP)
Kikuchi, Takashi (15-1-203, Hieitsuji-2 Otsu-shi, Shiga 04, 52001, JP)
International Classes:
C08G73/10; B29C41/12; C08J5/18
Attorney, Agent or Firm:
KANEKA CORPORATION (2-4 Nakanoshima 3-chome, Kita-ku Osaka-shi, Osaka 88, 53082, JP)
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