Title:
PROCESS FOR PRODUCTION OF POLYIMIDE FILM LAMINATE, AND POLYIMIDE FILM LAMINATE
Document Type and Number:
WIPO Patent Application WO/2012/011607
Kind Code:
A1
Abstract:
Provided is a process for producing a polyimide film laminate, which comprises applying a polyamic acid solution composition comprising a polyamic acid having a specified chemical composition and a specific mixed solvent onto a base material and heating the resulting product under specified conditions. Specifically provided is a process for producing a polyimide film laminate comprising a base material and a polyimide film, which comprises forming a coating film comprising a polyamic acid solution composition on the surface of a base material to produce a laminate composed of the base material and the polyamic acid solution composition, heating the laminate composed of the base material and the polyamic acid solution composition at a temperature ranging from at least 150 to 200°C exclusive for 10 minutes or longer, and then heating the heated laminate at a temperature up to 400 to 550°C. The polyamic acid solution composition is prepared by dissolving a polyamic acid comprising 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and/or pyromellitic acid dianhydride and p-phenylenediamine in a mixed solvent comprising an organic polar solvent and a solvent which forms an azeotrope with water, and the content of the solvent which forms an azeotrope with water is 5-35 mass% relative to the total amount of the solvents.
Inventors:
NAKAYAMA TOMONORI (JP)
SONOYAMA KENJI (JP)
NAKAYAMA TAKESHIGE (JP)
SONOYAMA KENJI (JP)
NAKAYAMA TAKESHIGE (JP)
Application Number:
PCT/JP2011/067175
Publication Date:
January 26, 2012
Filing Date:
July 21, 2011
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
NAKAYAMA TOMONORI (JP)
SONOYAMA KENJI (JP)
NAKAYAMA TAKESHIGE (JP)
NAKAYAMA TOMONORI (JP)
SONOYAMA KENJI (JP)
NAKAYAMA TAKESHIGE (JP)
International Classes:
B32B27/34; B32B15/088; C08G73/10; C08J5/22; H05K1/03
Domestic Patent References:
| WO2008004496A1 | 2008-01-10 |
Foreign References:
| JP2008239887A | 2008-10-09 | |||
| JP2008115377A | 2008-05-22 | |||
| JP2005138310A | 2005-06-02 | |||
| JP2006274130A | 2006-10-12 | |||
| JP2007332369A | 2007-12-27 | |||
| JP2009091573A | 2009-04-30 | |||
| JPH03157427A | 1991-07-05 | |||
| JPH05315630A | 1993-11-26 |
Other References:
See also references of EP 2596949A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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Claims: