Title:
PROCESS FOR REFINING CRUDE RESIN FOR ELECTRONIC MATERIAL
Document Type and Number:
WIPO Patent Application WO2004067688
Kind Code:
A3
Abstract:
A process is provided for effectively removing by-products such as oligomers contained within a crude resin for an electronic material, thus producing a resin for an electronic material. In this process, a crude resin for an electronic material containing (al) structural units derived from a (meth)acrylate ester with a hydrophilic site is washed using (b1) an organic solvent which is capable of dissolving said crude resin for an electronic material and which separates into two layers when combined with water, and (b2) water.
Inventors:
HADA HIDEO (JP)
IWAI TAKESHI (JP)
TAKESHITA MASARU (JP)
HAYASHI RYOTARO (JP)
MUROI MASAAKI (JP)
ATSUCHI KOTA (JP)
TOMIDA HIROAKI (JP)
SHIOTANI KAZUYUKI (JP)
IWAI TAKESHI (JP)
TAKESHITA MASARU (JP)
HAYASHI RYOTARO (JP)
MUROI MASAAKI (JP)
ATSUCHI KOTA (JP)
TOMIDA HIROAKI (JP)
SHIOTANI KAZUYUKI (JP)
Application Number:
PCT/JP2004/000776
Publication Date:
October 28, 2004
Filing Date:
January 28, 2004
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
HADA HIDEO (JP)
IWAI TAKESHI (JP)
TAKESHITA MASARU (JP)
HAYASHI RYOTARO (JP)
MUROI MASAAKI (JP)
ATSUCHI KOTA (JP)
TOMIDA HIROAKI (JP)
SHIOTANI KAZUYUKI (JP)
HADA HIDEO (JP)
IWAI TAKESHI (JP)
TAKESHITA MASARU (JP)
HAYASHI RYOTARO (JP)
MUROI MASAAKI (JP)
ATSUCHI KOTA (JP)
TOMIDA HIROAKI (JP)
SHIOTANI KAZUYUKI (JP)
International Classes:
C08F6/06; C08F220/28; C08J3/14; G03F7/039; G03F7/26; C11B; (IPC1-7): C08F220/28; C08J3/14; G03F7/039
Domestic Patent References:
| WO2002005034A1 | 2002-01-17 | |||
| WO2000001684A1 | 2000-01-13 |
Foreign References:
| JP2002201232A | 2002-07-19 | |||
| US6639035B1 | 2003-10-28 | |||
| US20030114589A1 | 2003-06-19 |
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