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Title:
PROCESS RELEASE FILM, USE THEREOF, AND METHOD OF PRODUCING RESIN-SEALED SEMICONDUCTOR USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/094871
Kind Code:
A1
Abstract:
Provided is a process release film that, regardless of the mold structure and amount of release agent, enables facile release of a molded article after resin sealing, and that can produce a molded article free of appearance defects such as wrinkles and chipping. This problem is solved by a process release film that is a laminate film containing a release layer A, a heat-resistant resin layer B, and as desired a release layer A', wherein the contact angle between water and the release layer A (and release layer A' when present) is 90° to 130° and the laminate film has a prescribed thermal dimensional variation ratio and/or tensile elastic modulus, or is solved by a process release film that is a laminate film containing a release layer A, a heat-resistant resin layer B, and as desired a release layer A', wherein the contact angle between water and the release layer A (and release layer A' when present) of the laminate film is 90° to 130°, the surface resistivity value of the release layer A is not more than 1 x 1013 ohm/square, the heat-resistant resin layer B contains a layer B1 that contains a polymeric antistatic agent, and the laminate film has a prescribed thermal dimensional variation ratio and/or tensile elastic modulus.

Inventors:
SHIMIZU MASARU (JP)
SHIMA KENJI (JP)
Application Number:
PCT/JP2016/085859
Publication Date:
June 08, 2017
Filing Date:
December 02, 2016
Export Citation:
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Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
B29C33/68; H01L21/56
Domestic Patent References:
WO2015037426A12015-03-19
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (JP)
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