Title:
PROCESS FOR SEPARATING INGREDIENT FROM WASTE SOLDERING PASTE, AND PROCESS FOR RECYCLING OF WASTE SOLDERING PASTE
Document Type and Number:
WIPO Patent Application WO/2010/076848
Kind Code:
A1
Abstract:
A soldering paste is stored at low temperature, and essentially used up once having been unsealed, while waste soldering paste is fundamentally discarded. Conventionally, the discarded soldering paste has been recycled by: combusting the discarded waste soldering paste to remove the flux component; subjecting the obtained material to re-melting and ingoting similarly to conventional recycling of a solder; converting the obtained ingot into a solder powder; and then preparing a soldering paste using the solder powder. Thus, a large energy was required in order to obtain a recycled solder powder.
Disclosed is a process which comprises: washing a recovered soldering paste with a solvent to remove the flux component adhering to the peripheries of the particles of the solder powder; and mixing the obtained material with a flesh flux to form a recycled soldering paste.
Inventors:
TOHJI KAZUYUKI (JP)
TAKAHASHI HIDEYUKI (JP)
TANAKA TAKESHI (JP)
TAKAHASHI HIDEYUKI (JP)
TANAKA TAKESHI (JP)
Application Number:
PCT/JP2009/007246
Publication Date:
July 08, 2010
Filing Date:
December 25, 2009
Export Citation:
Assignee:
ISHIKAWA METAL CO LTD (JP)
TOHOKU TECHNOARCH CO LTD (JP)
TOHJI KAZUYUKI (JP)
TAKAHASHI HIDEYUKI (JP)
TANAKA TAKESHI (JP)
TOHOKU TECHNOARCH CO LTD (JP)
TOHJI KAZUYUKI (JP)
TAKAHASHI HIDEYUKI (JP)
TANAKA TAKESHI (JP)
International Classes:
C22B1/00; B23K35/22; B23K35/40; C22B7/00
Foreign References:
| JPH0970692A | 1997-03-18 | |||
| JP2007224165A | 2007-09-06 | |||
| JPH07308502A | 1995-11-28 |
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki right tree (JP)
Hiroyuki right tree (JP)
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