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Patent Searching and Data


Title:
PROCESS FOR SURFACE MODIFICATION OF POLYIMIDE RESIN LAYERS AND PROCESS FOR PRODUCTION OF METAL-CLAD LAMINATES
Document Type and Number:
WIPO Patent Application WO/2008/018399
Kind Code:
A1
Abstract:
The invention relates to a surface treatment process for enhancing the adhesiveness of polyimide resin layers dramatically by simple surface treatment. This process brings about enhancement in the adhesiveness of polyimide resin layers even to a low-roughness copper foil suitable for fine-pitch pattern formation and can give metal-clad laminates useful as substrates for high-density printed wiring boards and HDD suspension. The process comprises the step (a) of treating the face of a polyimide resin layer with plasma to form a plasma-treated surface and the step (b) of applying a solution of an amino compound in a polar solvent on the plasma-treated surface and drying and heat-treating the resulting coating to form a surface modification layer. A polyimide resin layer obtained by the process which bears a modification layer on the face can advantageously give metal-clad laminates useful as wiring substrates by forming a metal layer on the surface of the modification layer by means of thermocompression bonding or vapor deposition.

Inventors:
SHINTA RYUZO (JP)
MATSUMURA YASUFUMI (JP)
MATSUSHITA YUJI (JP)
TAKEYAMA YOKO (JP)
Application Number:
PCT/JP2007/065338
Publication Date:
February 14, 2008
Filing Date:
August 06, 2007
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL CO (JP)
SHINTA RYUZO (JP)
MATSUMURA YASUFUMI (JP)
MATSUSHITA YUJI (JP)
TAKEYAMA YOKO (JP)
International Classes:
C08J7/00; B32B15/08; B32B15/088; C08J7/12
Foreign References:
JP2000239423A2000-09-05
JP2006182019A2006-07-13
JP2005306023A2005-11-04
JPH0114055A
JP2006007518A2006-01-12
JP2006007519A2006-01-12
JPH093221A1997-01-07
JPH1149880A1999-02-23
JP2007098791A2007-04-19
Attorney, Agent or Firm:
NARUSE, Katsuo et al. (TKK Nishishinbashi Bldg.11-5, Nishi-shinbashi 2-chome,Minato-k, Tokyo 03, JP)
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