PROCESS FOR SURFACE TREATMENT WITH IONS

Title:

PROCESS FOR SURFACE TREATMENT WITH IONS

Document Type and Number:

WIPO Patent Application WO1993014250

Kind Code:

A3

Abstract:

PCT No. PCT/EP92/03015 Sec. 371 Date Sep. 12, 1994 Sec. 102(e) Date Sep. 12, 1994 PCT Filed Dec. 31, 1992 PCT Pub. No. WO93/14250 PCT Pub. Date Jul. 22, 1993The invention relates to a process for cleaning and smoothing the surface of materials with a monocrystalline, polycrystalline or amorphous structure comprising the steps of: (a) polishing the surface to the lowest mechanically attainable roughness; (c) bombarding the surface with ions of a defined charge and kinetic energy to remove any impurities on the surface. To improve efficiency and especially to reduce the cleaning cycles it is proposed to bombard the surface with at least double-charged ions of low kinetic energy, where the potential energy of the ions causes an interaction with the bonded impurities in accordance with their high charge which removes said impurities. Furthermore the kinetic energy imparted to the ions is determined solely so that the ions can approach the atoms of the surface impurities as closely as possible without, however, penetrating the surface.

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Inventors:

ANDRAE JUERGEN (DE)

Application Number:

PCT/EP1992/003015

Publication Date:

February 03, 1994

Filing Date:

December 31, 1992

Export Citation:

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Assignee:

HOFFMEISTER HELMUT (DE)

International Classes:

B01J19/08; B08B7/00; C30B33/00; H01J27/18; H01J37/305; H01L21/302; H01L21/304; H01L21/3065; (IPC1-7): C30B33/00; H01L21/00

Other References:

OHMI ET AL: "formation of copper thin films by a low kinetic energy particle process", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 138, no. 4, April 1991 (1991-04-01), MANCHESTER, NEW HAMPSHIRE US, pages 1089 - 1097
CHENEY ET AL: "sputtering at acute incidence", JOURNAL OF APPLIED PHYSICS., vol. 36, no. 11, November 1965 (1965-11-01), NEW YORK US, pages 3542 - 3544

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