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Title:
PROCESS AND SYSTEM FOR CLEANING SURFACES OF SEMICONDUCTOR WAFERS
Document Type and Number:
WIPO Patent Application WO2005019490
Kind Code:
A3
Abstract:
A process for cleaning the surface of a semiconductor wafer. The process has the following steps: a) conveying a component selected from the group consisting of a dense gas component, a liquid component and a mixture thereof to a bellows accumulator (74) having a bellows (76) therein; b) applying an elevated pressure to said bellows (76) sufficient to discharge the component from the bellows onto said surface of the wafer; and c) contacting the component with the surface of the wafer. There is also a system for cleaning the surface of a semiconductor wafer and for mixing a dense gas component and a liquid component.

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Inventors:
WHITLOCK WALTER H
Application Number:
PCT/US2004/023830
Publication Date:
August 04, 2005
Filing Date:
July 23, 2004
Export Citation:
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Assignee:
BOC GROUP INC (US)
International Classes:
B08B7/00; C11D7/08; C11D7/26; C11D7/32; C11D11/00; (IPC1-7): B08B3/00
Foreign References:
US6596093B22003-07-22
US6547541B12003-04-15
US6085762A2000-07-11
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