PROCESSING APPARATUS AND METHOD OF CONTROLLING PROCESSING APPARATUS

WIPO Patent Application WO/2008/001835

A1

A method of controlling a processing apparatus capable of processing workpieces, such as grind stones, into a variety of shapes. The processing apparatus has an X-axis movement mechanism (9) capable of moving a tool (8) relative to a workpiece (7) into the X-axis direction in a two-dimensional plane (P), a Y-axis movement mechanism (10) capable of moving the tool in the Y-axis direction in the two-dimensional plane (P), and a θ-axis rotation mechanism (20) capable of rotating the tool (8) in the two-dimensional plane about the end (8a) of the tool (8) in contact with the workpiece. A controller of the processing apparatus designs a locus curve along which the tool (8) is moved and the attitude of the tool during the movement, controls the X-axis movement mechanism (9) and the Y-axis movement mechanism (10) to move the tool (8) along the locus curve, and controls the θ-axis rotating mechanism (20) to change the attitude of the tool (8) in the two-dimensional plane (P).

KUNUGI, Takahiro (11-6, Nishi Gotanda 3-chome, Shinagawa-k, Tokyo 03, 1418503, JP)
功刀 隆弘 (〒03 東京都品川区西五反田３丁目１１番６号ＴＨＫ株式会社内 Tokyo, 1418503, JP)
OGIHARA, Atsushi (11-6, Nishi Gotanda 3-chome, Shinagawa-k, Tokyo 03, 1418503, JP)

JP2007/062968

January 03, 2008

June 28, 2007

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THK CO., LTD. (11-6, Nishi Gotanda 3-chome Shinagawa-k, Tokyo 03, 1418503, JP)
ＴＨＫ株式会社 (〒03 東京都品川区西五反田３丁目１１番６号 Tokyo, 1418503, JP)
KUNUGI, Takahiro (11-6, Nishi Gotanda 3-chome, Shinagawa-k, Tokyo 03, 1418503, JP)
功刀 隆弘 (〒03 東京都品川区西五反田３丁目１１番６号ＴＨＫ株式会社内 Tokyo, 1418503, JP)

B23Q15/00; B24B53/06; B24B53/08; G05B19/4099

SHIOJIMA, Toshiyuki (Marutomo Tokyo Building 9F, 3-2-2 Iwamotocho, Chiyoda-k, Tokyo 32, 1010032, JP)

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