Title:
PROCESSING APPARATUS AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/054641
Kind Code:
A1
Abstract:
This processing device for processing a substrate comprises: a polishing mechanism which is provided with an annular grindstone for processing a substrate held by a holding mechanism; a polishing solution supply mechanism which supplies a polishing solution to the processing surface of the substrate; and an adjustment solution supply mechanism which supplies an adjustment solution for cooling an arbitrary position on the processing surface of the substrate.
Inventors:
KODAMA MUNEHISA (JP)
Application Number:
PCT/JP2021/031898
Publication Date:
March 17, 2022
Filing Date:
August 31, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B55/02; B24B7/04; B24B49/03; H01L21/304
Foreign References:
| JP2020093338A | 2020-06-18 | |||
| JP2017164823A | 2017-09-21 | |||
| JP2014103215A | 2014-06-05 | |||
| JP2004200526A | 2004-07-15 | |||
| JPH11333719A | 1999-12-07 | |||
| JPH05309566A | 1993-11-22 | |||
| JP2019214109A | 2019-12-19 | |||
| JP2020093381A | 2020-06-18 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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