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Title:
PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/135620
Kind Code:
A1
Abstract:
Provided is a processing apparatus (1) which includes a hemming punch and a lower die (11). The hemming punch and the lower die (11) are allowed to sandwich a workpiece (A) therebetween and then brought closer to each other, thereby processing the workpiece (A). The processing apparatus (1) also includes a transfer unit (R) for transferring the workpiece (A). The transfer unit (R) is provided with the hemming punch. The hemming punch is integrated with a suction unit for retaining the workpiece (A).

Inventors:
TOMINAGA MAKOTO (JP)
YAMANAKA TAKAYUKI (JP)
Application Number:
PCT/JP2010/003027
Publication Date:
November 03, 2011
Filing Date:
April 27, 2010
Export Citation:
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Assignee:
HIROTEC CORP (JP)
TOMINAGA MAKOTO (JP)
YAMANAKA TAKAYUKI (JP)
International Classes:
B21D39/02; B21D43/00
Foreign References:
JP2001286953A2001-10-16
JP2005103642A2005-04-21
JP2003311337A2003-11-05
JP2005014069A2005-01-20
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (JP)
Hiroshi Maeda (JP)
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Claims:



 
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