Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/196094
Kind Code:
A1
Abstract:
[Problem] To provide a processing apparatus with which the amount of noise and chips generated in the work station and leaking out to the worker-side setting station is reduced and the work environment can be improved. [Solution] A turntable (1) is provided so as to straddle a setting station (S1) and a work station (S2). The upper surface of the turntable (1) is divided equally by an upright wall (2) and on each of the equal divisions of the upper surface, setting jigs (3, 3) for setting workpieces (W) so as to be freely detachable are provided. The upright wall (2) is set to be higher than the workpieces (W) when set on the setting jigs (3) and transparent windows (4) for ascertaining work conditions inside the work station (S2) from the setting station (S1)-side are also formed. The setting station (S1) and the work station (S2) are partitioned by a partition (5) and the upper surface of the turntable (1) is positioned lower than the lower edge of the partition (5) so as to avoid interference. An opening (6), which is closed by the upright wall (2) when the turntable (1) is in the setting position (work position), is formed in the partition (5).

More Like This:
WO/2014/137125MACHINE TOOL
Inventors:
NAKAYAMA MASAYUKI (JP)
SERIKAWA YUICHI (JP)
YOSHIMURA HIROSHI (JP)
Application Number:
PCT/JP2013/078059
Publication Date:
December 11, 2014
Filing Date:
October 16, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B23Q11/08; B23Q7/00; B26F1/00
Foreign References:
JPH08108341A1996-04-30
JP2003094267A2003-04-03
JPH05192883A1993-08-03
JPH0733583U1995-06-20
Attorney, Agent or Firm:
KOYAMA, YUU (JP)
Hill 有 (JP)
Download PDF: