Title:
PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/196567
Kind Code:
A1
Abstract:
This processing apparatus 100 is equipped with a frame 1 having a first surface 3a along the Z-axis direction and a second surface 4a along the Y direction. A first movement mechanism 10 and second movement mechanism 30 are provided to the first surface 3a side of the frame 1. A third movement mechanism 30 is provided on the second surface 4a side of the frame 1. A stand 2 supports the frame 1 from the second surface 4a side of the frame 1. A first rotating mechanism 50, second rotating mechanism 60, and a support mechanism 40 which support a workpiece W are moved by a third movement mechanism. The third movement mechanism 30 is provided beneath the frame 1 in the Z axis direction, within a space formed by the stand 2. As a result of this configuration, it is easy to ensure machining accuracy of the workpiece W.
Inventors:
SUZUKI HITOSHI (JP)
MATSUMARU SEIICHI (JP)
FUJIU SUGURU (JP)
MATSUMARU SEIICHI (JP)
FUJIU SUGURU (JP)
Application Number:
PCT/JP2020/013171
Publication Date:
October 01, 2020
Filing Date:
March 24, 2020
Export Citation:
Assignee:
CANON DENSHI KK (JP)
International Classes:
B23Q17/00; B23Q1/01; B23Q1/48; B23Q1/72; B23Q3/06; B23Q3/157; A61C13/38
Domestic Patent References:
WO2011111902A1 | 2011-09-15 |
Foreign References:
KR101589550B1 | 2016-01-29 | |||
JP2017505720A | 2017-02-23 | |||
JP2014056537A | 2014-03-27 | |||
JP3194870U | 2014-12-11 | |||
JP2018030192A | 2018-03-01 | |||
JP2018001323A | 2018-01-11 |
Other References:
See also references of EP 3950221A4
Attorney, Agent or Firm:
CHIKASHIMA & ASSOCIATES (JP)
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