Title:
PROCESSING COMPUTATIONAL MODELS IN PARALLEL
Document Type and Number:
WIPO Patent Application WO/2020/159269
Kind Code:
A1
Abstract:
The present disclosure relates to an artificial intelligence chip for processing computations for machine learning models that provides a compute node and a method of processing a computational model using a plurality of compute nodes in parallel. In some embodiments, the compute node, comprises: a communication interface configured to communicate with one or more other compute nodes; a memory configured to store shared data that is shared with the one or more other compute nodes; and a processor configured to: determine an expected computational load for processing a computational model for input data; obtain a contributable computational load of the compute node and the one or more other compute nodes; and select a master node to distribute the determined expected computational load based on the obtained contributable computational load. Consequently, learning and inference can be performed efficiently on-device.
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Inventors:
LEE BYOUNG JOO (KR)
WOO JE MIN (KR)
LEE JIN JONG (KR)
JUN JUNG SIG (KR)
WOO JE MIN (KR)
LEE JIN JONG (KR)
JUN JUNG SIG (KR)
Application Number:
PCT/KR2020/001449
Publication Date:
August 06, 2020
Filing Date:
January 31, 2020
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
International Classes:
G06F9/50; G06F13/16
Foreign References:
| US20170048731A1 | 2017-02-16 | |||
| US20110191782A1 | 2011-08-04 | |||
| US9396023B1 | 2016-07-19 | |||
| US20140201758A1 | 2014-07-17 | |||
| US20150078126A1 | 2015-03-19 |
Attorney, Agent or Firm:
NAM & NAM (KR)
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