Title:
PROCESSING DEVICE EMPLOYING PLASMA, AND PROCESSING METHOD FOR PERFORMING PROCESS TO IRRADIATE PROCESSING TARGET WITH PLASMA
Document Type and Number:
WIPO Patent Application WO/2020/100818
Kind Code:
A1
Abstract:
In order to provide a processing device and a processing method employing plasma with which stability of maintaining a plasma lighting state is improved, while microwaves having a pulsed microwave power are used as the microwaves for generating the plasma, a processing device (10) employing plasma (25), according to the present invention, is provided with a processing chamber (14) for performing a process to irradiate a processing target (13) with the plasma (25), and a microwave supply unit (17) which supplies microwaves for generating the plasma (25) into the processing chamber (14), wherein the microwave supply unit (17) supplies first microwaves having a pulsed first microwave power in which a difference between a maximum value and a minimum value of the microwave power is at least equal to a first amplitude, and second microwaves having a steady second microwave power with little variation in the microwave power.
Inventors:
TAKIZAWA TSUTOMU (JP)
OISHI TOSHIHIRO (JP)
MORIMOTO MINEO (JP)
SAKAMOTO YUICHI (JP)
OISHI TOSHIHIRO (JP)
MORIMOTO MINEO (JP)
SAKAMOTO YUICHI (JP)
Application Number:
PCT/JP2019/044154
Publication Date:
May 22, 2020
Filing Date:
November 11, 2019
Export Citation:
Assignee:
SE CORP (JP)
International Classes:
H05H1/46
Foreign References:
| JP2014107363A | 2014-06-09 | |||
| JP2003173757A | 2003-06-20 | |||
| JP2007273189A | 2007-10-18 | |||
| JP2001168086A | 2001-06-22 | |||
| JPS63184300A | 1988-07-29 | |||
| JP2008016404A | 2008-01-24 |
Attorney, Agent or Firm:
SAKAMOTO & PARTNERS (JP)
Download PDF: