PROCESSING DEVICE AND METHOD FOR MEASURING WORKPIECE TEMPERATURE IN PROCESSING DEVICE

Title:

PROCESSING DEVICE AND METHOD FOR MEASURING WORKPIECE TEMPERATURE IN PROCESSING DEVICE

Document Type and Number:

WIPO Patent Application WO/2014/162665

Kind Code:

A1

Abstract:

Provided are a processing device (1) and a method making it possible to accurately measure the substance temperature of a workpiece housed in a chamber and heated. The processing device (1) is provided with the chamber (2) for housing the workpiece (W), a measurement piece (6) provided in the chamber (2), and a measurement unit (8). The measurement piece (6) thermally expands and contracts due to the effect of the temperature in the chamber (2). The measurement unit (8) measures the amount of thermal expansion and contraction of the measurement piece (6) and thereby measures the substance temperature of the workpiece (W).

Inventors:

FUJII HIROFUMI

Application Number:

PCT/JP2014/001383

Publication Date:

October 09, 2014

Filing Date:

March 11, 2014

Export Citation:

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Assignee:

KOBE STEEL LTD (JP)

International Classes:

C23C14/52; C23C16/44; G01K5/50

Foreign References:

JP2009212199A	2009-09-17
JPH0727634A	1995-01-31
JP2000206070A	2000-07-28
JP2836876B2	1998-12-14
JPH0658814A	1994-03-04
JP3042786B2	2000-05-22
JP4607287B2	2011-01-05
JP2002350248A	2002-12-04

Other References: