Title:
PROCESSING DEVICE, PROCESSING METHOD, AND TRANSPARENT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/156183
Kind Code:
A1
Abstract:
[Problem] A technique is provided allowing fine processing at high efficiency without requiring reforming of a material. [Solution] A first laser 10 irradiates a processing object 100 with a first laser light 11 having a wavelength that passes through the processing object 100, via a light-focusing unit 31. A second laser 20 irradiates the processing object 100 with a second laser light having a wavelength that passes through the processing object 100. By focusing the first laser light 11, the light-focusing unit 31 generates a high-electron-density region in which free electrons are excited within the processing object 100. Irradiation of the processing object 100 with the light of the second laser 20 is performed so as to pass through the position of the high-electron-density region during the period from before the disappearance of the high-electron-density region generated by the radiation of the first laser light 11, until immediately after the disappearance.
Inventors:
SUGITA NAOHIKO (JP)
ITO YUSUKE (JP)
YOSHIZAKI REINA (JP)
MIYAMOTO NAOYUKI (JP)
ITO YUSUKE (JP)
YOSHIZAKI REINA (JP)
MIYAMOTO NAOYUKI (JP)
Application Number:
PCT/JP2019/004479
Publication Date:
August 15, 2019
Filing Date:
February 07, 2019
Export Citation:
Assignee:
UNIV TOKYO (JP)
International Classes:
B23K26/53; B23K26/062; B23K26/382
Foreign References:
| JP2003205383A | 2003-07-22 | |||
| JP2006035710A | 2006-02-09 | |||
| JP2014534939A | 2014-12-25 | |||
| JP2014033218A | 2014-02-20 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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