Title:
PROCESSING DEVICE AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/184178
Kind Code:
A1
Abstract:
A processing device according to the present invention has: a modification unit which forms a modified layer by irradiating the interior of a workpiece retained by a retaining part with a laser beam; a measurement unit which measures the output of the laser beam; a moving part which moves the retaining part between a first position, where the workpiece is transported into and out of the retaining part, and a second position where the modified layer is formed by the modification unit; and a control unit which controls the retaining part, the modification unit, the measurement unit, and the moving part. The control unit controls the retaining part, the measurement unit, and the moving part such that the output of the laser beam is measured by the measurement unit while the retaining part is waiting at the first position.
Inventors:
MORI HIROTOSHI (JP)
KAWAGUCHI YOSHIHIRO (JP)
KAWAGUCHI YOSHIHIRO (JP)
Application Number:
PCT/JP2020/007697
Publication Date:
September 17, 2020
Filing Date:
February 26, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B23K26/00; B23K26/53; H01L21/304; H01L21/683
Foreign References:
| JP2019033162A | 2019-02-28 | |||
| JP2004111426A | 2004-04-08 | |||
| JP2018051605A | 2018-04-05 | |||
| JP2001351876A | 2001-12-21 | |||
| JP2004111606A | 2004-04-08 | |||
| JP2006108532A | 2006-04-20 | |||
| JP2019063828A | 2019-04-25 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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