Title:
PROCESSING DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2021/250996
Kind Code:
A1
Abstract:
[Problem] To provide a processing device and method for safely processing a wafer having bumps formed on a surface thereof. [Solution] A processing device 10 is provided with: a chuck 40 capable of holding a bump region 24 of a wafer 20; a support ring 30 having a support surface 32 for supporting a bend region 26 which extends from the bump region 24 to an outer peripheral region 25 and in which a film 20 is bent, the support ring 30 capable of supporting the outer peripheral region 25 of the wafer 20; and a chuck table 16 in which the chuck 40 is housed substantially centrally and the support ring 30 is housed around the chuck 40.
Inventors:
KANAZAWA MASAKI (JP)
Application Number:
PCT/JP2021/015397
Publication Date:
December 16, 2021
Filing Date:
April 14, 2021
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
H01L21/304; H01L21/683
Foreign References:
| JP2020025010A | 2020-02-13 | |||
| JP2019212803A | 2019-12-12 | |||
| JP2018122421A | 2018-08-09 | |||
| JP2020025008A | 2020-02-13 | |||
| US20170282326A1 | 2017-10-05 |
Attorney, Agent or Firm:
SHIMIZU Takamitsu (JP)
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