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Patent Searching and Data


Title:
PROCESSING DEVICE AND TECHNOLOGY FOR ANTI-SLIP SOLE
Document Type and Number:
WIPO Patent Application WO/2022/151750
Kind Code:
A1
Abstract:
A processing device and technology for an anti-slip sole. The processing device comprises a forming mechanism for forming a buffer portion at the bottom of an anti-slip layer (5). The forming mechanism comprises an air inlet device (1) for heating and softening a thermoplastic elastic layer (6), and a buffer forming device (2) for forming a heated and softened thermoplastic elastic material into the buffer portion at the bottom of the anti-slip layer (5). By processing buffer blocks between anti-slip portions at the bottom of the anti-slip layer (5), the sole has not only anti-slip performance but also a buffering effect.

Inventors:
PENG PIAOLIN (CN)
LIU ZHAOXIA (CN)
LI ZHENGSHI (CN)
LV MEILIAN (CN)
Application Number:
PCT/CN2021/118636
Publication Date:
July 21, 2022
Filing Date:
September 16, 2021
Export Citation:
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Assignee:
UNIV LIMING VOCATIONAL (CN)
International Classes:
B29D35/12; B29D35/14; A43B13/00
Domestic Patent References:
WO2014123958A12014-08-14
Foreign References:
CN112917963A2021-06-08
CN112841810A2021-05-28
US6032388A2000-03-07
US5077916A1992-01-07
CN1370674A2002-09-25
CN108143051A2018-06-12
CN108515714A2018-09-11
CN211993829U2020-11-24
KR20090117593A2009-11-12
Attorney, Agent or Firm:
QUANZHOU WENHUA PATENT AGENY CO., LTD. (CN)
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