Title:
PROCESSING DEVICE FOR THIN PLATE MATERIAL AND PROCESSING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2018/056259
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a processing device for thin plate material that can perform stable punch processing without reducing productivity, and a processing method for the same. Provided are a processing device (10) for thin plate material having an upper mold (12) provided with a punch (11), a lower mold (60) provided with a die (61), and a stripper plate (15) that can be raised and lowered with the upper mold (12), pushes the thin plate material (13) against the lower mold (60) during punch processing, and guides a tip part of the punch (11) into a die hole (62), and a processing method for the same, wherein pilot pins (21) passing through the stripper plate (15) are inserted into pilot holes formed in a region other than both end parts in the direction of width of the thin plate material and the thin plate material is positioned and punched, after which when the stripper plate (15) is pulled and separated from the thin plate material, the pilot pins (21) are pulled out of the pilot holes while making pressing members (27) provided at the peripheral parts of the pilot pins (21) protrude from the stripper plate (15) and press on the surface of the thin plate material.
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Inventors:
IWATA KENICHIROU (JP)
Application Number:
PCT/JP2017/033716
Publication Date:
March 29, 2018
Filing Date:
September 19, 2017
Export Citation:
Assignee:
MITSUI HIGH TEC (JP)
International Classes:
B21D43/04; B21D28/00; B21D28/04; B21D28/02
Foreign References:
| JPS5272543U | 1977-05-31 | |||
| JPH0538531A | 1993-02-19 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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