Title:
PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/094646
Kind Code:
A1
Abstract:
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.
Inventors:
SHIMODA MAKOTO (JP)
KANAZAWA MASAKI (JP)
KANAZAWA MASAKI (JP)
Application Number:
PCT/JP2016/085119
Publication Date:
June 08, 2017
Filing Date:
November 28, 2016
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
H01L21/304; B24B7/00
Foreign References:
| JPH11245147A | 1999-09-14 | |||
| JP2010172999A | 2010-08-12 | |||
| JPH11309664A | 1999-11-09 | |||
| JP2015199158A | 2015-11-12 |
Attorney, Agent or Firm:
SHIMIZU Takamitsu (JP)
Download PDF:
Previous Patent: SYSTEMS AND METHODS FOR SIGNALLING APPLICATION ACCESSIBILITY
Next Patent: SWIRL-FLOW GAS-LIQUID MIXING DEVICE FOR AQUACULTURE
Next Patent: SWIRL-FLOW GAS-LIQUID MIXING DEVICE FOR AQUACULTURE