Title:
PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/195342
Kind Code:
A1
Abstract:
The processing device pertaining to the present invention is provided with a support rod for supporting a work piece, a base on which the support rod is installed and on which the work piece is mounted via the support rod, a processing means for processing the work piece mounted on the base, a movement means for moving the relative positions of the processing means and the base, a calculation unit for calculating installation position information indicating the installation position of the support rod installed on the base on the basis of processing shape information of the work piece, and a support rod installation means for installing the support rod in the installation position on the base corresponding to the installation position information on the basis of the installation position information calculated by the calculation unit, and the work piece is therefore supported at a support point corresponding to the shape of the work piece. Bending of the work piece is therefore suppressed.
Inventors:
HATAZAWA HIKARU (JP)
Application Number:
PCT/JP2016/064239
Publication Date:
November 16, 2017
Filing Date:
May 13, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23Q3/06; B23K26/10; B23Q3/02; B23Q1/03; B26F3/00
Domestic Patent References:
| WO2013104741A1 | 2013-07-18 |
Foreign References:
| EP0507033A1 | 1992-10-07 | |||
| JPH05146888A | 1993-06-15 |
Attorney, Agent or Firm:
INABA, Tadahiko et al. (JP)
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