Title:
PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/053153
Kind Code:
A1
Abstract:
In order to prevent raw material soil from adhering to a processing device for processing raw material soil, this processing device comprises: a first member having a wall surface with which raw material soil makes contact; a second member that is provided below or on the inside of the wall surface, and that makes contact with the raw material soil and processes the raw material soil; and a supply device for supplying to the first member and the second member an adhesion prevention agent for preventing adhesion of the raw material soil.
Inventors:
SEKIGUCHI MASAKAZU (JP)
OBATA HIROSHI (JP)
OBATA HIROSHI (JP)
Application Number:
PCT/JP2023/016095
Publication Date:
March 14, 2024
Filing Date:
April 24, 2023
Export Citation:
Assignee:
JAPAN DEV & CONSTRUCTION (JP)
International Classes:
E02F7/00
Domestic Patent References:
| WO2017109888A1 | 2017-06-29 | |||
| WO2021251066A1 | 2021-12-16 |
Foreign References:
| JP2002097663A | 2002-04-02 | |||
| JP2007090323A | 2007-04-12 | |||
| JP2000334291A | 2000-12-05 | |||
| JP2001329564A | 2001-11-30 | |||
| JP2015093977A | 2015-05-18 | |||
| JP2020033437A | 2020-03-05 | |||
| JP2000355954A | 2000-12-26 | |||
| JP2015003292A | 2015-01-08 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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