Title:
PROCESSING FLUID SUPPLY METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/153045
Kind Code:
A1
Abstract:
The present invention relates to a processing fluid supply method and a substrate processing device. This processing fluid supply method is for a substrate processing device 1, which comprises a nozzle 8 for discharging a processing fluid, a pipe 12 connected to the nozzle 8, an open/close valve 17 provided to the pipe 12, and a suck-back valve 18 provided to the pipe 12 between the nozzle 8 and the open/close valve 17, the method comprising: a discharge stop step for causing the open/close valve 17 to perform a closing operation, thereby stopping the discharge of the processing fluid from the nozzle 8; and a fluid cut position adjustment step for causing the suck-back valve 18 to perform a first suctioning operation in conjunction with the closing operation of the open/close valve 17, thereby adjusting a fluid cut position where the processing fluid discharged in a columnar shape from the nozzle 8 is cut.
Inventors:
SAGAWA HIDETOSHI (JP)
NISHIMURA JUNKI (JP)
YAMAMOTO SATOSHI (JP)
NISHIMURA JUNKI (JP)
YAMAMOTO SATOSHI (JP)
Application Number:
PCT/JP2022/043002
Publication Date:
August 17, 2023
Filing Date:
November 21, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/027
Domestic Patent References:
| WO2016047182A1 | 2016-03-31 |
Foreign References:
| JP2016111306A | 2016-06-20 | |||
| JP2010171295A | 2010-08-05 | |||
| JP2016139665A | 2016-08-04 | |||
| JPH05293358A | 1993-11-09 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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