Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PROCESSING HEAD AND LASER PROCESSING MACHINE
Document Type and Number:
WIPO Patent Application WO/2017/203613
Kind Code:
A1
Abstract:
A processing head (1) applies, to an object (W) to be processed, a laser beam (L) produced through oscillation by a laser oscillator (200). The processing head (1) is provided with a processing lens (20) that condenses the laser beam (L). The processing head (1) is provided with an optical component (40) that is arranged so as to be rotatable, around a rotation axis (41) intersecting with an axis (AX) parallel to an optical axis (P0) of the processing lens (20), between a protruding position (SL) through which the laser beam (L) that has been oscillated by the laser oscillator (200) and that is to enter the processing lens (20) passes, and a withdrawn position (EL) away from the laser beam (L).

Inventors:
MIYAMOTO NAOKI (JP)
NAGAI RYOTARO (JP)
SASAKI NOZOMU (JP)
INOUE YOKO (JP)
SEGUCHI MASAKI (JP)
Application Number:
PCT/JP2016/065364
Publication Date:
November 30, 2017
Filing Date:
May 24, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/046
Foreign References:
JPH01177737U1989-12-19
JP2015205346A2015-11-19
JP2013025000A2013-02-04
JP2005140597A2005-06-02
JP2015044238A2015-03-12
JP2016068131A2016-05-09
JP2013248656A2013-12-12
JPS56156479U1981-11-21
US20140347655A12014-11-27
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
Download PDF: