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Patent Searching and Data


Title:
PROCESSING METHOD AND PROCESSING DEVICE FOR ELECTRONIC/ELECTRICAL DEVICE COMPONENT SCRAP
Document Type and Number:
WIPO Patent Application WO/2020/218376
Kind Code:
A1
Abstract:
Provided is a processing method for electronic/electrical device component scrap in which, in a sorting and processing step for smelting processing raw material for sorting, from the electronic/electrical device component scrap, a processing raw material that includes a valuable metal for processing in a smelting step, it is possible to reduce, in advance, component scrap that causes problems with the sorting and processing step. Provided is the processing method for electronic/electrical device component scrap, including a smelting raw material sorting and processing step for sorting the processing raw material that includes a valuable metal that can be processed in a smelting step from the electronic/electrical device component scrap, wherein the processing method for electronic/electrical device component scrap includes using a parallel link robot to remove lump copper wire scrap included in the electronic/electrical device component scrap.

Inventors:
AOKI KATSUSHI (JP)
Application Number:
JP2020/017390
Publication Date:
October 29, 2020
Filing Date:
April 22, 2020
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B07C5/342; B07C5/36; B09B5/00; B25J11/00; C22B1/00; G06T7/00; G06T7/90
Foreign References:
JP2012210598A2012-11-01
JP2017170388A2017-09-28
JP2012115785A2012-06-21
JP5969685B12016-08-17
JP2019034399A2019-03-07
JP2003534930A2003-11-25
JP2013000685A2013-01-07
JP2013255901A2013-12-26
JP2002105548A2002-04-10
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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