PROCESSING OBJECT RETAINER, WIRE ELECTRIC DISCHARGE PROCESSING DEVICE, THIN SHEET PRODUCTION METHOD, AND SEMICONDUCTOR WAFER PRODUCTION METHOD

Title:

PROCESSING OBJECT RETAINER, WIRE ELECTRIC DISCHARGE PROCESSING DEVICE, THIN SHEET PRODUCTION METHOD, AND SEMICONDUCTOR WAFER PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2011/145390

Kind Code:

A1

Abstract:

Disclosed is a processing object retainer (10) that holds a processing object (8) when same is cut in a wire electric discharge processing device that cuts processing objects by electrical discharge from wire electrodes (2) provided spaced apart and in parallel. A fitting section (102) is formed wherein processing objects are fitted substantially without interval, and that, when same is cut together with the processing objects fitted therein, assumes an external form whereby the length of the section of the processing object retainer and processing object that faces the wire electrodes is substantially constant during cutting of the processing object.

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Inventors:

YUZAWA, Takashi (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
湯澤　隆 (〒10 東京都千代田区丸の内二丁目７番３号　三菱電機株式会社内 Tokyo, 〒1008310, JP)
MIYAKE, Hidetaka (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
三宅　英孝 (〒10 東京都千代田区丸の内二丁目７番３号　三菱電機株式会社内 Tokyo, 〒1008310, JP)

Application Number:

JP2011/057048

Publication Date:

November 24, 2011

Filing Date:

March 23, 2011

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Assignee:

Mitsubishi Electric Corporation (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
三菱電機株式会社 (〒10 東京都千代田区丸の内二丁目７番３号 Tokyo, 〒1008310, JP)
YUZAWA, Takashi (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
湯澤　隆 (〒10 東京都千代田区丸の内二丁目７番３号　三菱電機株式会社内 Tokyo, 〒1008310, JP)
MIYAKE, Hidetaka (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)

International Classes:

B23H7/02

Attorney, Agent or Firm:

SAKAI, Hiroaki (Sakai International Patent Office, Kasumigaseki Building 2-5, Kasumigaseki 3-chome, Chiyoda-k, Tokyo 20, 〒1006020, JP)

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Claims:

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