Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRODUCT PACKAGING HAVING A NON-THERMOFORMED BLISTER-LIKE COMPARTMENT AND METHODS FOR MAKING SAME
Document Type and Number:
WIPO Patent Application WO2002026569
Kind Code:
A3
Abstract:
A product package is described for enclosing an item in a non-thermoformed blister-like compartment. Also described are approaches for making the package. According to various aspects of the described package and manufacturing techniques, a blank (10) is cut out of a sheet of see-through plastic material (11), the blank having a plurality of panels (12, 14a-d) and flange sections (16) such that the blank can be formed, without thermoforming, into a blister-like compartment having a plurality of panels defining an enclosure with a mouth at its base and a flange at the mouth's perimeter. The blank may include printing, cutouts, perforations, or other features. The blank is then folded into a blister-like compartment and loaded with the item to be packaged. A backing (30) is positioned to enclose the loaded blister-like compartment and affixed to the flange.

Inventors:
MAZUREK RICHARD (US)
Application Number:
PCT/US2001/027730
Publication Date:
September 06, 2002
Filing Date:
September 25, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
IMPAC GROUP INC (US)
MAZUREK RICHARD (US)
International Classes:
B65D5/32; B65D5/42; B65D5/54; (IPC1-7): B65D5/32; B65D5/42; B65D5/54
Foreign References:
US5564569A1996-10-15
US5117972A1992-06-02
EP0899201A11999-03-03
US4501364A1985-02-26
US3372802A1968-03-12
FR2583721A11986-12-26
US4777338A1988-10-11
GB1299270A1972-12-13
Download PDF: