Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRODUCTION METHOD FOR BONDED STRUCTURE, AND BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/129392
Kind Code:
A1
Abstract:
A production method for a bonded structure (1) wherein a metal member (2) and a resin member (3) are bonded, and a bonded structure (1) wherein the metal member (2) and the resin member (3) are bonded. The production method for the bonded structure (1) includes: a roughening step wherein an uneven part (4) is formed in a top-surface part (5) of the metal member (2) by means of laser irradiation; a boring step wherein a bore (7) is formed in the top-surface part (5) of the metal member (2) by irradiating the uneven part (4) with a laser; and a bonding step wherein the metal member (2) and the resin member (3) are bonded by filling the bore (7) with the resin member (3). In the bonded structure (1), an uneven part (4) is formed in a top-surface part (5) of the metal member (2) by means of laser irradiation, and a bore (7) that is formed in the uneven part (4) by means of laser irradiation is filled with the resin member (3).

Inventors:
NISHIKAWA KAZUYOSHI (JP)
Application Number:
PCT/JP2016/052372
Publication Date:
August 18, 2016
Filing Date:
January 27, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B23K26/324; B23K26/0622; B23K26/352; B23K26/386; B29C45/14; B29C65/16; B29C65/70
Domestic Patent References:
WO2002092276A12002-11-21
Foreign References:
JP2014166693A2014-09-11
JP2013529137A2013-07-18
JP2011143539A2011-07-28
JP2010274279A2010-12-09
JP2003204137A2003-07-18
US20090017242A12009-01-15
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: PRODUCTION METHOD FOR BONDED STRUCTURE, AND BONDED STRUCTURE

Next Patent: METHOD FOR AMC AND AMC CONTROLLER