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Title:
PRODUCTION METHOD FOR COPPER PARTICLES, BONDING PASTE, SEMICONDUCTOR DEVICE, AND ELECTRICAL AND ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2020/044982
Kind Code:
A1
Abstract:
Provided is a production method for copper particles used in bonding, the method being characterized in that a copper compound (A) is reduced by a reducing compound (C) in the presence of a carboxylic acid-amine salt (B).

Inventors:
KIKUCHI TOMONAO (JP)
NITANAI YUYA (JP)
Application Number:
PCT/JP2019/030831
Publication Date:
March 05, 2020
Filing Date:
August 06, 2019
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/52; B22F1/00; B22F7/08; B22F9/24; H01B1/02; H01B1/22; H01B13/00
Foreign References:
JP2016033260A2016-03-10
JP2017022125A2017-01-26
JP2016003343A2016-01-12
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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