PRODUCTION METHOD FOR COPPER PARTICLES USED IN BONDING , PASTE USED IN BONDING, AND SEMICONDUCTOR DEVICE AND ELECTRIC AND ELECTRONIC COMPONENT

Title:

PRODUCTION METHOD FOR COPPER PARTICLES USED IN BONDING , PASTE USED IN BONDING, AND SEMICONDUCTOR DEVICE AND ELECTRIC AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2020/105497

Kind Code:

A1

Abstract:

A production method for copper particles used in bonding comprising a step in which, by means of a liquid-phase reduction method, (A) a copper layer is further formed on a surface of a metal copper powder.

Inventors:

KIKUCHI TOMONAO (JP)
NITANAI YUYA (JP)

Application Number:

PCT/JP2019/044166

Publication Date:

May 28, 2020

Filing Date:

November 11, 2019

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Assignee:

KYOCERA CORP (JP)

International Classes:

B22F1/00; B22F1/102; H01B1/00; H01B1/22; H01B13/00

Foreign References:

JP2010174348A	2010-08-12
JP2015124412A	2015-07-06
JP2015210973A	2015-11-24

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

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