Title:
PRODUCTION METHOD FOR CURED PRODUCT, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, PROCESSING LIQUID, AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/190063
Kind Code:
A1
Abstract:
Provided are: a production method for a cured product including a film-forming step for using a resin composition including a solvent and a polyimide precursor which includes a repeating unit represented by formula (1) on a base material to form a film, a processing step for putting a processing liquid and the film in contact, and a heating step for heating the film after the processing step, wherein the processing liquid includes at least one compound selected from the group consisting of a basic compound and a base generating agent; a production method for a semiconductor device including the cured product; and the processing liquid used in the production method for the cured product.
Inventors:
NARA YUKI (JP)
OOTA KAZUYA (JP)
OOTA KAZUYA (JP)
Application Number:
PCT/JP2023/011592
Publication Date:
October 05, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/14; G03F7/027; G03F7/40; H01L21/312
Domestic Patent References:
| WO2022050135A1 | 2022-03-10 | |||
| WO2022050041A1 | 2022-03-10 | |||
| WO2022070730A1 | 2022-04-07 |
Foreign References:
| US20210364919A1 | 2021-11-25 | |||
| JPH08339089A | 1996-12-24 | |||
| JP2022021937A | 2022-02-03 | |||
| JP2022110943A | 2022-07-29 | |||
| JP7259141B1 | 2023-04-17 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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