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Title:
PRODUCTION METHOD FOR FLEXIBLE PACKAGING FILM
Document Type and Number:
WIPO Patent Application WO/2019/167638
Kind Code:
A1
Abstract:
This production method is for a flexible packaging film that is a laminate of a first substrate and a second substrate having interposed therebetween a reactive adhesive of a polyisocyanate composition (X) and a polyol composition (Y), the method comprising a two-part application step for bringing a liquid mixture of the polyisocyanate composition (X) and the polyol composition (Y) applied to the first substrate into contact with a catalyst (Z) formed as dots on the second substrate, and performing bonding under pressure. The substrates are each preferably a plastic film, a metal vapor deposition film, or a metal foil. A non-stretchable film is preferably used as the second substrate.

Inventors:
HATA Kiyomi (Tokyo Plant 35-58, Sakashita 3-chome, Itabashi-k, Tokyo 20, 〒1748520, JP)
TAKAHASHI Shigekazu (Tokyo Plant 35-58, Sakashita 3-chome, Itabashi-k, Tokyo 20, 〒1748520, JP)
Application Number:
JP2019/005249
Publication Date:
September 06, 2019
Filing Date:
February 14, 2019
Export Citation:
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Assignee:
DIC CORPORATION (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
International Classes:
C09J175/04; B32B27/40; B32B37/12; B65D65/40; C08G18/10; C08G18/16; C08G18/36; C08G18/38; C08G18/42; C08G18/48; C09J5/04; C09J11/06
Domestic Patent References:
WO2015046453A12015-04-02
WO2016152370A12016-09-29
Foreign References:
JP2003171643A2003-06-20
JP2014189639A2014-10-06
JP2016074780A2016-05-12
JPH04202588A1992-07-23
JP2012502166A2012-01-26
Attorney, Agent or Firm:
OGAWA Shinji (7-20 Nihonbashi 3-chome, Chuo-k, Tokyo 33, 〒1038233, JP)
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