Title:
PRODUCTION METHOD FOR PRINTED WIRING BOARD HAVING DIELECTRIC LAYER
Document Type and Number:
WIPO Patent Application WO/2017/085849
Kind Code:
A1
Abstract:
Metal-clad laminated plates(10) are prepared that comprise a first metal foil (12a) laminated on one surface of a dielectric layer (11) having a thickness of no more than 30 µm, a second metal foil (12b) laminated on the other surface, and first and second carriers (13a, 13b) laminated to the first and second foils (12a, 12b) via a release layer (14); a pair of metal-clad laminated plates (10) are used, the metal-clad laminated plates (10) and a resin base material (21) are laminated, and a laminate (20) is formed on each surface of a the resin base material (21), such that the first carrier (13a) in the metal-clad laminated plates (10) faces the resin base material (21); the second carrier (13b) is separated from the laminate and the second metal foil (12b) exposed; the second metal foil (12b) is etched and a conductive pattern (30) formed; an insulation layer (35) is laminated upon the conductive pattern (30) and a metal layer (37) is laminated upon the insulation layer (35); and the first carrier (13a) and the first metal foil (12a) are separated. The dielectric layer does not include a reinforcing material.
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Inventors:
SHIMIZU TOSHIYUKI (JP)
Application Number:
PCT/JP2015/082627
Publication Date:
May 26, 2017
Filing Date:
November 19, 2015
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H05K3/46; B32B15/08; B32B37/26
Foreign References:
| JP2001308548A | 2001-11-02 | |||
| JP2004216830A | 2004-08-05 | |||
| JP2003292733A | 2003-10-15 | |||
| JP2007123940A | 2007-05-17 | |||
| JP2006253656A | 2006-09-21 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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