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Title:
PRODUCTION METHOD FOR SILICON WAFER ROUGH-POLISHING COMPOSITION, SILICON WAFER ROUGH-POLISHING COMPOSITION SET, AND SILICON WAFER POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/025656
Kind Code:
A1
Abstract:
The present invention provides a production method for a silicon wafer rough-polishing composition, said method being capable of simultaneously providing excellent stability and the advantage of a concentrated liquid, and enabling improvement in edge roll-off. The production method for a silicon wafer rough-polishing composition according to the present invention is a method for producing a silicon wafer rough-polishing composition that contains abrasive particles, a basic compound, and a water-soluble polymer. This production method comprises: a step for preparing liquid A that contains the abrasive particles and the basic compound; a step for preparing liquid B that contains, as the water-soluble polymer, a water-soluble polymer P1 having a radius of gyration of at least 100 nm; and a step for mixing liquid A and liquid B.

Inventors:
MURASE, Takehiko (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
TABATA, Makoto (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
TANIGUCHI, Megumi (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
TSUCHIYA, Kohsuke (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
Application Number:
JP2017/026406
Publication Date:
February 08, 2018
Filing Date:
July 21, 2017
Export Citation:
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Assignee:
FUJIMI INCORPORATED (1-1 Chiryo 2-chome, Nishibiwajima-cho Kiyosu-sh, Aichi 02, 〒4528502, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
WO2015098777A12015-07-02
Foreign References:
JP2016135882A2016-07-28
Attorney, Agent or Firm:
ABE, Makoto (Kyodo Patent Law Firm, BPR Place Hisaya-Odori 3-20-3, Marunouchi, Naka-ku, Nagoya-sh, Aichi 02, 〒4600002, JP)
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