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Patent Searching and Data


Title:
PRODUCTION METHOD FOR THERMOPLASTIC RESIN FOAM, MOLDING MOLD THEREFOR AND THERMOPLASTIC RESIN FOAM
Document Type and Number:
WIPO Patent Application WO/2001/015882
Kind Code:
A1
Abstract:
A thermoplastic resin foam in a desired shape, having a high expansion ratio and cells of a desired diameter, especially fine foam cells. A production method for a thermoplastic resin foam, comprising the steps of filling a thermoplastic resin containing a foaming agent into a cavity (31) of a mold (2a), and then foaming the resin by expanding the cavity (31), wherein, after a molten resin containing a foaming agent is filled into the cavity (31), the cavity (31) is expanded to a final cavity expansion width when an average temperature of the filled resin in the cavity (31) reaches a range from resin melting point to melting point plus 30°C with the cavity kept in a filled shape.

Inventors:
HARADA HIROSHI (JP)
KAWAUCHI HITOSHI (JP)
HIRANO HIROYUKI (JP)
SHIMURA SATOSHI (JP)
Application Number:
PCT/JP2000/005776
Publication Date:
March 08, 2001
Filing Date:
August 25, 2000
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
HARADA HIROSHI (JP)
KAWAUCHI HITOSHI (JP)
HIRANO HIROYUKI (JP)
SHIMURA SATOSHI (JP)
International Classes:
B29C44/08; B29C44/58; B29C44/34; (IPC1-7): B29C45/26; B29C44/42; B29C44/58; B29C45/00
Foreign References:
JPH0788878A1995-04-04
JPH1119961A1999-01-26
EP0799853A11997-10-08
JPS5457573A1979-05-09
US5474723A1995-12-12
JP2000037744A2000-02-08
Other References:
See also references of EP 1226918A4
Attorney, Agent or Firm:
Kishimoto, Einosuke (3rd Floor 13-18 Nishishinsaibashi 1-chome Chuo-ku, Osaka-shi Osaka, JP)
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