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Title:
PRODUCTION METHOD FOR TRANSFER MOLD, TRANSFER MOLD PRODUCED USING SAME, AND COMPONENT PRODUCED USING SAID TRANSFER MOLD
Document Type and Number:
WIPO Patent Application WO/2013/072953
Kind Code:
A1
Abstract:
Provided are: a transfer mold for forming a component using electroforming, that has excellent durability, and has an aspect ratio; and the component produced using same. Also provided is a production step for the transfer mold, including: a step in which a component-shaped resist pattern having a desired aspect ratio and a desired angle (α) for the side wall thereof is formed upon a metal substrate (10); a step in which the component-shaped resist pattern is filled up to a prescribed depth, using electroforming, and a transfer mold is produced; and a step in which this transfer mold is pull out of the metal substrate, and a master mold (20) is produced.

Inventors:
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
Application Number:
PCT/JP2011/006355
Publication Date:
May 23, 2013
Filing Date:
November 15, 2011
Export Citation:
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Assignee:
LEAP CO LTD (JP)
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
International Classes:
B29C33/38; C25D1/10
Foreign References:
JPH1050576A1998-02-20
JPH01246391A1989-10-02
JPH117663A1999-01-12
JP2004340661A2004-12-02
JP2005335345A2005-12-08
JPS4841936A1973-06-19
JP2006330080A2006-12-07
JP2011195911A2011-10-06
JP2006317807A2006-11-24
JP2004001535A2004-01-08
JP2004257861A2004-09-16
Other References:
See also references of EP 2781628A4
Attorney, Agent or Firm:
HAGIHARA, MAKOTO (JP)
Makoto Hagiwara (JP)
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Claims:



 
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