Title:
PRODUCTION METHOD FOR TRANSFER MOLD, TRANSFER MOLD PRODUCED USING SAME, AND COMPONENT PRODUCED USING SAID TRANSFER MOLD
Document Type and Number:
WIPO Patent Application WO/2013/072954
Kind Code:
A1
Abstract:
Provided are: a transfer mold for forming a component, using electroforming, that has good workability and excellent durability; and the component produced using same. Also provided is a production method for the transfer mold, that includes: a step in which a reversed pattern of a desired component pattern is formed upon a metal substrate (10), the metal substrate (10) is etched using the reversed pattern as a mask, and the desired component pattern is formed; and a step in which the reversed pattern is heat treated, or the reversed pattern is removed, and insulation layers (30, 50) are formed at the removal site.
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Inventors:
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
TERADA TOKINORI (JP)
Application Number:
PCT/JP2011/006356
Publication Date:
May 23, 2013
Filing Date:
November 15, 2011
Export Citation:
Assignee:
LEAP CO LTD (JP)
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
International Classes:
C25D1/10; B29C33/38
Foreign References:
| JPH08162352A | 1996-06-21 | |||
| JP2003138393A | 2003-05-14 | |||
| JPS5591866U | 1980-06-25 | |||
| JP2002260753A | 2002-09-13 | |||
| JP2004001535A | 2004-01-08 | |||
| JP2004257861A | 2004-09-16 |
Other References:
See also references of EP 2781626A4
Attorney, Agent or Firm:
HAGIHARA, MAKOTO (JP)
Makoto Hagiwara (JP)
Makoto Hagiwara (JP)
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Claims: