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Patent Searching and Data


Title:
PRODUCTION METHOD OF WAFER LENS, INTERMEDIATE DIE, OPTICAL COMPONENT, MOLDING DIE, AND PRODUCTION METHOD OF MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2010/143466
Kind Code:
A1
Abstract:
Provided are a wafer lens production method, an intermediate die, an optical component, and a molding die, by which a resin portion such as a lens portion, etc., should not be made unnecessarily thick and the wafer lens can be downsized, as well as a production method of a molding die having a preferable shape and a superior releasability. The production method of a wafer lens (1) is provided with a first intermediate die production step for producing a first intermediate die (8) from a die (7), a second intermediate die production step for producing a second intermediate die (9) from the first intermediate die (8), and a wafer lens production step for producing the wafer lens (1) from the second intermediate die (9). A first intermediate die base plate (80) is provided on the surface facing the die (7) with a recess (85) in which a top portion (71a) or a peripheral portion (77) of a molding portion (71) of the die (7) is to be arranged, the portion to be arranged in the recess (85) being the portion closer to at least the first intermediate die base plate (80). When a photo-curable resin (84A) is pressed, the portion closer to at least the first intermediate die base plate (80) between the top portion (71a) and the peripheral portion (77) of the die (7) is arranged in the recess (85), and a predetermined gap is provided so that the die (7) does not contact a recessed surface (85a) of the recess (85).

Inventors:
TERAMOTO TOUGO (JP)
FUJII YUITI (JP)
IMAI TOSHIYUKI (JP)
SATO AKIRA (JP)
HOSOE SHIGERU (JP)
Application Number:
PCT/JP2010/056306
Publication Date:
December 16, 2010
Filing Date:
April 07, 2010
Export Citation:
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Assignee:
KONICA MINOLTA OPTO INC (JP)
TERAMOTO TOUGO (JP)
FUJII YUITI (JP)
IMAI TOSHIYUKI (JP)
SATO AKIRA (JP)
HOSOE SHIGERU (JP)
International Classes:
B29D11/00; G02B3/00
Foreign References:
JP2000275405A2000-10-06
JP2001201609A2001-07-27
JPS57609A1982-01-05
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