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Patent Searching and Data


Title:
PRODUCTION PROCESS OF MULTILAYER UNIT FOR MULTILAYER ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2005/022567
Kind Code:
A1
Abstract:
A production process of the multilayer unit of a multilayer electronic component consisting of dielectric layers and electrode layers, improved such that permeation of electrode paste into the dielectric layers and deformation of the dielectric layers and electrode layers are prevented, the unit can be used in the form of a roll body without causing the problem of back transfer of a sheet for adhesive layer required for production, and a multilayer unit sheet is provided with an adhesive layer and can be obtained in the form of a roll body without causing the problem of back transfer. A roll body (4) of a multilayer unit sheet (40) having a layer structure of first support sheet/mold release layer/print assist layer/electrode-spacer layer/adhesive layer/dielectric layer /(adhesive layer/mold release layer/second support sheet/back transfer preventive layer) is produced by performing a transfer process (first through third steps) and an adhesion process (fourth step) sequentially using a green sheet roll body (1), a roll body for adhesive layer (2) and a roll body for electrode layer (3) in a specified layer structure.

Inventors:
KANASUGI MASAAKI (JP)
SATOU SHIGEKI (JP)
Application Number:
PCT/JP2004/011173
Publication Date:
March 10, 2005
Filing Date:
August 04, 2004
Export Citation:
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Assignee:
TDK CORP (JP)
KANASUGI MASAAKI (JP)
SATOU SHIGEKI (JP)
International Classes:
H01G4/30; H01G4/12; (IPC1-7): H01G4/12
Foreign References:
JP2001044064A2001-02-16
JP2002343674A2002-11-29
JPH11238646A1999-08-31
JPH07312326A1995-11-28
Attorney, Agent or Firm:
Okada, Kazuhiko (6F Kudan Kangyo Bldg., 10-1, Kudan-Kita 1-chom, Chiyoda-ku Tokyo 73, JP)
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