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Patent Searching and Data


Title:
PRODUCTION PROCESS FOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2017/171084
Kind Code:
A1
Abstract:
The present invention bonds a label to an adherend with a heat-sensitive adhesive layer disposed therebetween, by sufficiently activating the heat-sensitive adhesive layer. Prepared is a label 1 which comprises a label base 4 and a heat-sensitive adhesive layer 3 disposed on the back surface of the label base 4, wherein an ultraviolet-absorbing heating agent is contained in an area of the label base 4 which at least includes the disposed heat-sensitive adhesive layer 3 and/or in the heat-sensitive adhesive layer 3. Before or after the label 1 is applied to an adherend 9, irradiation with ultraviolet is conducted to activate the heat-sensitive adhesive layer 3.

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Inventors:
MATSUNAGA GOSUKE (JP)
MIYAZAKI AKIRA (JP)
YOSHIDA NAO (JP)
ETANI YUKITOSHI (JP)
Application Number:
PCT/JP2017/013837
Publication Date:
October 05, 2017
Filing Date:
March 31, 2017
Export Citation:
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Assignee:
FUJI SEAL INT INC (JP)
International Classes:
B65C9/25; B65B53/00; G09F3/04; G09F3/10
Foreign References:
JP2008145497A2008-06-26
JPS6420475U1989-02-01
Other References:
See also references of EP 3438011A4
Attorney, Agent or Firm:
MAKOTO INTERNATIONAL PATENT ATTORNEYS OFFICE (JP)
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