Title:
PRODUCTION PROCESS TAPE FOR FILM-SHAPED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2005/054345
Kind Code:
A1
Abstract:
A production process tape for film-shaped wiring board that exhibits high heat resistance, mechanical properties, moldability and dimensional stability and that excels in productivity and workability, realizing low cost. There is provided a production process tape for film-shaped wiring board, which consists of a sheet comprising at least one thermoplastic resin, the thermoplastic resin selected from among a polysulfone resin, a thermoplastic polyimide resin and a polyether aromatic ketone resin, and a plate filler, which sheet exhibits an antiflexing strength (JIS P8155: tension 250 g, flexing rate 175 times/min, and flexing surface 0.38R) of 10 times or more and a linear expansion coefficient of 50 ppm/°C or below.
Inventors:
KANADA ARIHIRO (JP)
Application Number:
PCT/JP2004/017046
Publication Date:
June 16, 2005
Filing Date:
November 17, 2004
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
KANADA ARIHIRO (JP)
KANADA ARIHIRO (JP)
International Classes:
C08J5/18; H01L21/60; H05K1/03; C08K3/22; H05K1/00; (IPC1-7): C08J5/18; H01L21/60
Domestic Patent References:
| WO2002018495A1 | 2002-03-07 | |||
| WO2003066740A1 | 2003-08-14 |
Foreign References:
| JP2002338823A | 2002-11-27 | |||
| JP2003292803A | 2003-10-15 | |||
| JPS6348835A | 1988-03-01 | |||
| JPS6454792A | 1989-03-02 | |||
| JP2003128931A | 2003-05-08 | |||
| JP2004168962A | 2004-06-17 | |||
| JP2004182832A | 2004-07-02 | |||
| JP2004253723A | 2004-09-09 | |||
| JP2004349366A | 2004-12-09 |
Attorney, Agent or Firm:
Morioka, Hiroshi (Hirogaki Bldg. 11-13, Higashi-temma 1-chome,
Kita-ku, Osaka-sh, Osaka 44, JP)
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