Title:
PROFILE HAVING LOW THERMAL CONDUCTANCE
Document Type and Number:
WIPO Patent Application WO/2022/028013
Kind Code:
A1
Abstract:
A profile having low thermal conductance, comprising an internal foam profile (1) and aluminum alloy profiles (2) compounded with the upper and lower surfaces of the foam profile (1). The foam profile (1) is a closed-cell foam profile formed by extruding and foaming high-strength engineering plastics, and the aluminum alloy profiles (2) are compounded with the upper and lower surfaces of the foam profile (1). By means of the profile, heat conduction of aluminum alloy is blocked by a plastic foamed profile, so that the thermal insulation performance is good, and the aluminum alloy profiles (2) are firmly connected to the foam profile (1).
Inventors:
CHENG ZHENSHUO (CN)
XUE MINGSHENG (CN)
XUE MINGSHENG (CN)
Application Number:
PCT/CN2021/090586
Publication Date:
February 10, 2022
Filing Date:
April 28, 2021
Export Citation:
Assignee:
CHENG ZHENSHUO (CN)
XUE MINGSHENG (CN)
XUE MINGSHENG (CN)
International Classes:
E06B1/32; E06B3/263; E06B5/16
Domestic Patent References:
| WO2019055363A1 | 2019-03-21 | |||
| WO2017185232A1 | 2017-11-02 |
Foreign References:
| CN110043159A | 2019-07-23 | |||
| CN103541628A | 2014-01-29 | |||
| CN204266775U | 2015-04-15 | |||
| CN111287604A | 2020-06-16 | |||
| CN211115418U | 2020-07-28 | |||
| CN103195334A | 2013-07-10 | |||
| GB2523638B | 2016-05-18 | |||
| DE202009004237U1 | 2009-06-04 |
Attorney, Agent or Firm:
KEYCOM PARTNERS, P.C. (CN)
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